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FISCHER ELEKTRONIK ICK BGA 23X23 Heat Sink, For Ball Grid Array, BGA, PLCC, 23 �C/W, 6 mm, 23 mm, 23 mm Cokin CX495B Surface Mount product from COILCRAFT

SKU 46125341756
4.2
USD125.41 USD173.41

Pay in 4 interest-free payments of $31.35 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Aug 14 - Aug 19

Description

Surface Mount product from COILCRAFT with the model number CU8965-ALDProduct details

Brand VISHAY Part Number PHP01206E2001BST3 Quantity Each (Supplied on Cut Tape) Technical Data Sheet EN

Reset Temperature 100°C Contact Rating 120VAC/15A

This 50mm lens provides what is considered a normal angle of view on full-frame cameras

UPC: 050234010245

FISCHER ELEKTRONIK ICK BGA 23X23 Heat Sink, For Ball Grid Array, BGA, PLCC, 23 �C/W, 6 mm, 23 mm, 23 mm Cokin CX495B Surface Mount product from COILCRAFTThe ICK BGA 23X23 is a 23 x 23 x 6mm Heat Sink made of aluminium with black anodized surface. This ICK series heat sink can be attached to recommended devices by thermal conductive adhesives and foils. This heat sink acts as a socket suitable for universal processors. 1. 8mm Plate thickness Applications Industrial Product details External Diameter Metric Packages Cooled BGA, PLCC Heat Sink Material Aluminium Thermal Resistance 23C W External Length

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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